| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of cracks on a wafer where protrusions are formed along an external edge thereof. SOLUTION: A sheet peeling device 10 includes: a table 11 for supporting a semiconductor wafer (W); an unreeling means 12 for unreeling a peeling tape (PT), a pushing means 15 for pressing the peeling tape (PT) to an adhesive sheet (S) so as to be adhered thereto; a moving means 16 which allows the peeling tape (PT) and table 11 adhered to the adhesive sheet (S) to carry out relative movement thereof so as to peel the adhesive sheet (S); and a control means 19 for controlling the foregoing means. The table 11 includes a displacement means 20. The displacement means 20 includes a heating means 20A for heating a space enclosed by a semiconductor wafer (W) and mounting tape (MT), and also a cooling means 20B for cooling the space. This results in increasing or decreasing the volume of the space (A). COPYRIGHT: (C)2010,JPO&INPIT |
