| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a nonadhesive type copper-clad laminate by a laminating method, high in adhesiveness between a copper foil and a resin, excellent in etching performance, and suitable for forming a fine pitch. Ž<P>SOLUTION: This copper-clad laminate has structure bonded with the copper foil and a resin film via a thermoplastic resin, the copper foil is provided with a copper foil base material, and a coating layer for coating at least one part of a copper foil base material face, the coating layer is constituted of an Ni layer and a Cr layer laminated sequentially from the copper foil base material face, the coating layer contains respective coating amounts of 15-210 μg/dm<SP>2</SP>of Cr and 15-440 μg/dm<SP>2</SP>of Ni, a cross section of the coating layer has the maximum thickness of 0.5-5 mm when observed by a transmission electron microscope, and has the minimum thickness of 80% or more of the maximum thickness, the coating layer contacts with the thermoplastic resin, and a polyimide film and the thermoplastic resin have one, two or more of through holes penetrated therethrough. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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