| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film capable of sufficiently suppressing curvature of a substrate and excellent in connection reliability. SOLUTION: The adhesive film comprises a curable resin composition, wherein the glass transition temperature after curing is 65-110°C, the elastic modulus after curing at 40°C is≤1,500 MPa, and the elastic modulus after curing at 100°C is≥10 MPa. COPYRIGHT: (C)2010,JPO&INPIT |
