| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce effects caused by stress of a conductive bump as well as suppressing variations in a bonding strength when bonding a crystal oscillation piece to a base, and to prevent the crystal oscillation piece from being cracked during conductive bump bonding. Ž<P>SOLUTION: In a crystal oscillator 1, a crystal oscillation piece 2 including an oscillation part and a hold part is held by being bonded to a base 3 by a conductive bump B. In the hold part, a conductive bump bonding part, a thin part spacing the conductive bump bonding part from the thin oscillation part, and the like are formed. The conductive bump bonding part includes a principal surface bonding area that becomes a plane in counter to a plane of a mounting part of the base and a thin wall surface bonding area different in planar direction from the plane of the mounting part of the base. In a state where a central part of the conductive bump is bonded to the principal surface bonding area and a terminal of the bump is spaced apart from a counter part of the principal surface bonding area in the thin part, the terminal of the bump is partially bonded to the wall surface bonding area in the thin part at a side of the principal surface bonding area. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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