发明名称 |
CLOSED LOOP WIRE BONDING METHODS AND BONDING FORCE CALIBRATION |
摘要 |
A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
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申请公布号 |
US2010108744(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20070297521 |
申请日期 |
2007.10.05 |
申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
QIN WEI;AHMAD ZIAUDDIN;MOLNAR JOHN DAVID;SOOD DEEPAK;FRASCH E. WALTER;HU CHUNLONG |
分类号 |
B23K31/12 |
主分类号 |
B23K31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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