发明名称 WIRING BOARD, PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board having excellent termination characteristics even in high frequency bands of≥20 GHz, and enabling a mounted semiconductor element to normally operate. <P>SOLUTION: The wiring board 8 is equipped with: a dielectric substrate 1; a signal line conductor 2 arranged on one main surface of the dielectric substrate 1; grounding conductors 3 arranged with a space on both sides of the signal line conductor 2; a resistor 4 for connecting one end of the signal line conductor 2 to the grounding conductors 3; a bias terminal electrode 5 arranged so as to be insulated from the grounding conductors 3 on the one main surface of the dielectric substrate 1; a bias conductor 6 arranged on the other main surface of the dielectric substrate 1, and having one end connected to one end of the signal line conductor 2 and the other end connected to the bias terminal electrode 5 respectively via a through hole 6c; and a radio wave absorber 7 connected to the bias conductor 6 along a length direction. Electromagnetic coupling between the signal line conductor 2 and the bias conductor 6 is not strong, and even if electromagnetic coupling occurs, the radio wave absorber 7 attenuates to reduce reflection to the signal line conductor 2, which provides the wiring board with the excellent termination characteristics. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010103452(A) 申请公布日期 2010.05.06
申请号 JP20080326971 申请日期 2008.12.24
申请人 KYOCERA CORP 发明人 IINO MICHINOBU;YOSHIHARA JUNKO
分类号 H01L23/00;H01L23/02 主分类号 H01L23/00
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