| 摘要 |
A semiconductor device comprises a first substrate (6), multiply-divided second substrates (9) that are provided on the first substrate (6), cooling members (10) provided on the first substrate (6) in gaps between the second substrates (9), and a third substrate (1) provided on the second substrate (9) and the cooling members (10). Heat pipes, or the like, may be used for the cooling members (10). |
