| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a low wire loop. <P>SOLUTION: In the semiconductor device, an initial ball is joined to a pad 13 to form a bonding ball 23 and a ball neck 25, and then a capillary 41 is raised for moving in a direction opposite to that of a lead 17 and then is lowered to stamp down the ball neck 25 by a face section 43 at the side of the lead. After that, the capillary 41 is raised and is moved toward the lead until the face section 43 of the capillary 41 is on the ball neck 25, and a wire 21 is folded toward the lead 17. Then, the capillary 41 is lowered to press the side of the wire folded on the ball neck 25 by the capillary 41, and the capillary 41 is moved obliquely upward toward the lead before looping to crimp the wire 21 to the lead. <P>COPYRIGHT: (C)2010,JPO&INPIT |
