| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board that hardly generates solder bump breakage of a mounted semiconductor chip. <P>SOLUTION: A coreless substrate 20, which is a kind of a printed wiring board, includes an insulating layer 26a having a main surface, and a connection pad 24 buried in the insulating layer 26a. The connection pad 24 includes a hat-like shape. That is, the connection pad 24 consists of a plate part 36 with a diameter ϕ1 of about 95 μm, and a contact part 38 with a diameter ϕc of 75 μm. A main surface 39 of the contact part 38 is exposed in the main surface 7 of the insulating layer 26a. Since the diameter ϕc of the contact part 38 is substantially the same as a diameter ϕ2 of an under bump metal 11 on the semiconductor chip 8 side, when mechanical stress is added in a direction in which the semiconductor chip 8 is peeled from the coreless substrate 20, the stress is equally dispersed to both sides of the connection pad 24 and the under bump metal 11, and as a result, it is hard to generate breakage. <P>COPYRIGHT: (C)2010,JPO&INPIT |
