CONNECTION STRUCTURE AND CONNECTION METHOD FOR ELECTRONIC COMPONENT

摘要

<P>PROBLEM TO BE SOLVED: To provide a connection structure and a connection method for an electronic component that can secure high connection reliability at low cost with high productivity. Ž<P>SOLUTION: The connection structure for the electronic component formed by connecting a terminal 16 provided to a flexible substrate 10 to an electrode 6 of a rigid substrate 5 includes: a resin portion 7* interposed between a terminal formation surface 10a and a connection surface 5a to bond both together; a butt solder joint portion 15a* interposed in a butt joint surface between a surface 16a of the terminal 16 and a surface 6a of the electrode 6 to solder both together; and a fillet-shaped fillet solder joint portion 15b* formed at a corner C of the surface 6a of the electrode 6 and a side surface 16b of the terminal 16 formed by making different the plane size B2 of the terminal 16 and the plane size B1 of the electrode 6. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž