| 摘要 |
<p>A piezo-electric film forming method includes a first moving step of moving the nozzle (22) with respect to a substrate (4) along a first direction (S) to form a first piezo-electric band (31A) extending along the first direction; a measuring step of measuring thickness distribution along the width of the first piezo-electric band (31); a calculating step of calculating a shifting distance based on the thickness distribution; a shifting step of moving the nozzle (22) with respect to the substrate (4) along a second direction (M) by the calculated shifting distance, wherein the second direction intersects with the first direction; and a second moving step of moving the nozzle (22) with respect to the substrate (4) along the first direction to form a second piezo-electric band (31) extending along the first direction. The piezo-electric film (32) is formed such that the first piezo-electric band (31A) and the second piezo-electric band (31) are overlapped (D0) in the second direction.</p> |
