SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE

摘要

Disclosed is a substrate for a light emitting element package, wherein sufficient heat dissipation effects can be obtained from the light emitting element, and cost and size are reduced, as a substrate for packaging the light emitting element. A light emitting element package using such substrate is also disclosed. Specifically, the substrate for the light emitting element package is provided with an insulating layer (1) composed of a resin (1a) containing heat conductive fillers (1b, 1c), a thick metal section (2) formed under the mounting position of a light emitting element (4), and a surface electrode section (3) formed separately from the thick metal section (2) on the mounting side of the insulating layer (1).