| 摘要 |
PURPOSE: A system for sawing and sorting semiconductor packages is provided to improve inspection efficiency by inspecting the lower side of the semiconductor packages while the semiconductor packages are transferred through a package transfer part. CONSTITUTION: Strips are stacked in a magazine. A magazine loader part(10) loads the magazine on the conveyor of the magazine loader. A loader part(20) absorbs the strips and feeds the strips to a sawing device. A revolver part(40) loads semiconductor packages, which is sawn from the strips, on a strap transfer(50). The strap transfer transfers the semiconductor packages to an exchanger. The upper sides of the semiconductor packages are inspected using the scan camera of a vision inspection device.
|
