| 摘要 |
According to one embodiment, an electronic apparatus has a housing, a first heat emitter and a second heat emitter which are accommodated in the housing, and a cooling device accommodated in the housing. The cooling device includes a heat sink to cool the first heat emitter, a first heat pipe which thermally connects the first heat emitter with the heat sink, a second heat pipe, and a fan unit which cools the heat sink and the second heat pipe. The second heat pipe has a first end portion which is thermally connected to the second heat emitter, and a second end portion which is located near the heat sink.
|
