PACKAGE FOR ELECTRONIC COMPONENT, PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A package for the electronic component, and the piezoelectric device and manufacturing method thereof fuse the sealing material arranged in the sealing hole of the solid. It is hermetical, the internal space can be the sealing. CONSTITUTION: A ceiling hole(40) is formed on the first substrate(10) and the second substrate. The metal layer is formed in the inner wall of the sealing hole. The piezoelectric oscillation piece is arranged between the first substrate and the second substrate. The first substrate and the second substrate are welded. The sealing material(45a) of the solidity is arranged within the sealing hole.