发明名称 High conductivity ground planes for integrated lead suspensions
摘要 An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.
申请公布号 US7710687(B1) 申请公布日期 2010.05.04
申请号 US20060531468 申请日期 2006.09.13
申请人 HUTCHINSON TECHNOLOGY INCORPORATED 发明人 CARLSON KEITH W.;WEBB, JR. LARRY C.;WEBBER VALERIE J.
分类号 G11B5/48 主分类号 G11B5/48
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