发明名称 |
High conductivity ground planes for integrated lead suspensions |
摘要 |
An integrated lead flexure or suspension including an insulating layer, a plurality of traces on the insulating layer and a stainless steel base layer on the side of the insulating layer opposite the traces. The traces are free of a conductive shield layer on the side opposite the insulating layer. One or more voids extend through the stainless steel layer below the traces. The voids are filled with a high conductivity metal layer.
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申请公布号 |
US7710687(B1) |
申请公布日期 |
2010.05.04 |
申请号 |
US20060531468 |
申请日期 |
2006.09.13 |
申请人 |
HUTCHINSON TECHNOLOGY INCORPORATED |
发明人 |
CARLSON KEITH W.;WEBB, JR. LARRY C.;WEBBER VALERIE J. |
分类号 |
G11B5/48 |
主分类号 |
G11B5/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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