| 摘要 |
An apparatus and a method for forming a solder bump are provided to accurately transcribe a solder on a substrate by applying radio frequency oscillation to the solder and transcribing the solder to a underlying bumping metal in the substrate. Molten solder(140) is implanted onto a template(120) and the solder is solidified. The template and a substrate(110) are aligned to each other. Radio frequency waves are applied to the solder on the template and thus the solder is molten. The molten solder is transcribed onto the substrate and thus a solder bump is formed on the substrate. |
