| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit wiring board with built-in components which is suitable for reduction in size and thickness in three-dimensional mounting by using a semiconductor device having high reliability for connection between double-sided wiring lines. <P>SOLUTION: The circuit wiring board with built-in components includes: an intermediate circuit wiring board 41 with an opening 41h; a first and a second circuit wiring boards 42 and 43 laminated on both sides thereof; and a semiconductor device 1 housed in the opening. The semiconductor device 1 includes: a semiconductor chip fragmented by dicing a wafer; a first and a second insulating films formed on both sides of the chip; a first rewiring layer 7 formed on a surface of the first insulating film, including a pad 8; a second rewiring layer 9 formed on a surface of the second insulating film, including a pad part 8; and an interlayer wiring layer 10 formed on a side surface along the dicing line to electrically connects the first and second rewiring layers to each other. Each pad part of the first and second rewiring layers is electrically connected to a wiring layer provided on the second circuit wiring board. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
