| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device in which temperature rise of solder balls arranged near corner parts is suppressed, and fatigue life is extended. <P>SOLUTION: The semiconductor device includes: an organic multilayer wiring board having an inner layer conductor layer; a semiconductor element loaded and connected to one surface of the wiring board; and a plurality of solder balls arranged like a grid array on the other surface. Then, in the inner layer conductor layer, a defective parts are formed in: regions corresponding to solder balls (corner solder balls) arranged at outer edge corner parts; or regions corresponding to a plurality of solder balls arranged in the corner solder balls and their surroundings. <P>COPYRIGHT: (C)2010,JPO&INPIT |
