| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck, having a long life and superior abrasion resistance which restrains wafer suction surface or the electrostatic suction mounting surface from being scratched, and which suppresses generation of dust. SOLUTION: The electrostatic chuck 1 for chucking an object, such as, a semiconductor wafer or a glass substrate, such that an insulation layer 5, forming a surface for sucking the object, is formed to cover electrodes 3a, 3b for electrostatic chucking formed on one surface of a supporting substrate 2, the insulation layer 5 has a coefficient of dynamic friction of 0.3 or less and a large number of micro recesses are formed on the surface of the insulation layer 5. COPYRIGHT: (C)2010,JPO&INPIT |
