| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method wherein a polished workpiece can be kept flat and the flatness of the polished workpiece can be maintained during polishing. <P>SOLUTION: When a polished workpiece is polished, a back pad 1 is sticked on the undersurface of a surface pressure plate 71 using a double-faced tape. A template 76 has an opening part exposing a skin layer of the back pad 1 to which the polished workpiece 78 is stuck and inserted, and the polished workpiece 78 is abutted to a buildup area of the approximately center of the skin layer by soaking the skin layer with a moderate amount of water. After that the polished workpiece 78 is forcibly pressed approximately-uniformly toward the surface pressure plate 71 and held by the back pad 1. The pressure surface plate 71 applies pressure downward to the polished workpiece 78 and polishes the undersurface of the polished workpiece 78 with a polishing cloth 75 by rotating a rotating surface plate 72. Air caught between the skin layer and the polished workpiece 78 is taken into foam through multiple pores, thereby the polished workpiece 78 is maintained approximately flat by back pad 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
