| 摘要 |
<p>A DIE BONDING METHOD AND APPARATUS BY WHICH A WAFER SUBSTRATE (11) ADHERED TO A CARRIER TAPE (13) BY AN ADHESIVE LAYER (12) IS LASER MACHINED THROUGH THE WAFER SUBSTRATE AND THROUGH THE ADHESIVE LAYER AT MOST TO SCRIBE THE CARRIER TAPE TO FORM A SINGULATED DIE (15) WITH AN ATTACHED SINGULATED ADHESIVE LAYER, WITHOUT SUBSTANTIAL DELAMINATION OF THE ADHESIVE LAYER (12) AND CARRIER TAPE (13) OR SUBSTANTIAL PRODUCTION OF BURRS FROM THE ADHESIVE LAYER (1.2). THE CARRIER TAPE (13) IS CURED, PREFERABLY BY ULTRAVIOLET LIGHT~ TO RELEASE THE ADHESIVE LAYER FROM THE CARRIER TAPE. THE SINGULATED DIE IS PICKED AND PLACED ON A DIE PAD AND THE ADHESIVE LAYER (12) IS CURED, PREFERABLY BY HEAT, TO ADHERE THE DIE TO THE DIE PAD.</p> |
