| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a heat release property in a semiconductor device including a heat sink thermally connected to one plate surface of a semiconductor chip, the semiconductor chip being connected to a substrate by its other plate surface. Ž<P>SOLUTION: A semiconductor wafer 200 having a plurality of chip forming areas 1 defined by dicing lines 2 on one surface side is prepared, a plate-like heat sink 20 formed in a plate-like shape the same as the chip forming areas 1 and having a projection part 21 projecting in a direction orthogonal to the plate surface on the outer circumferential end is prepared, a hole part 11 is formed in a position crossing each dicing line 2 in the semiconductor wafer 200, metal films 10a having solder wettability are disposed simultaneously on each chip forming area 1 and the inner surface of the hole part 11, a solder 60 is arranged thereon, the heat sink 20 is mounted on each chip forming area 1 while inserting the projection part 21 to the hole part 11, the solder 60 is melted to solder the heat sink 20, and the semiconductor wafer 200 is diced. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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