发明名称 |
High Frequency Module for Filling Level Measurements in the W-Band |
摘要 |
A high-frequency module is for fill level measuring and for use at frequencies of more than 75 GHz. The high-frequency module comprises a microwave semiconductor, a printed circuit board and a housing bonded to the printed circuit board. In order to reduce the power required, operation of the microwave semiconductor takes place in a pulsed manner.
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申请公布号 |
US2010103024(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20090559835 |
申请日期 |
2009.09.15 |
申请人 |
SCHULTHEISS DANIEL;FISCHER MICHAEL |
发明人 |
SCHULTHEISS DANIEL;FISCHER MICHAEL |
分类号 |
G01S13/08;G01F23/00 |
主分类号 |
G01S13/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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