摘要 |
A polishing apparatus includes a cyclic mechanism moving cyclically in a certain direction, a holder moving cyclically by the cyclic mechanism in a direction parallel to an object to be polished, a plurality of polishing pins held on the holder, a magnet member including a first part which is exposed on a front face side of the polishing pin and a second part which is not exposed on the front face side of the polishing pin, a part of the second part being covered with a non-magnetic material, and a polishing member held on the polishing pin by magnetic force of the magnet member and polishing a tip of the object to be polished by the cyclic motion of the cyclic mechanism, wherein a contact area of the polishing member and the polishing pin includes a contact area of the magnet member and the polishing member.
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