PACKAGE FOR INTEGRATED CIRCUIT DIE

摘要

A circuit package for housing semiconductor or other integrated circuit devices (110) including a high-copper flange (102), one or more high-copper leads (106) and a liquid crystal polymer frame (104) molded to the flange and the leads. The leads comprise a metal conductor with a plurality of laterally spaced holes (310) that allow an amount of thermoplastic frame to freeze and lock the leads into the frame during the process of molding. Other retention features (800) not co-planar with the lead are also provided comprising a hooked or bent edge at one end of the lead, further preventing the lead from being pulled out of the frame (104).