发明名称 |
METHOD AND APPARATUS FOR PROCESSING SUBSTRATE |
摘要 |
A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.
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申请公布号 |
US2010105154(A1) |
申请公布日期 |
2010.04.29 |
申请号 |
US20100685820 |
申请日期 |
2010.01.12 |
申请人 |
WANG XINMING;TAKAGI DAISUKE;TASHIRO AKIHIKO;FUKUNAGA YUKIO;FUKUNAGA AKIRA;OWATARI AKIRA;NISHIOKA YUKIKO |
发明人 |
WANG XINMING;TAKAGI DAISUKE;TASHIRO AKIHIKO;FUKUNAGA YUKIO;FUKUNAGA AKIRA;OWATARI AKIRA;NISHIOKA YUKIKO |
分类号 |
H01L21/66;C23C18/16;C23C18/18;H01L21/00;H01L21/02;H01L21/288;H01L21/306;H01L21/321;H01L21/46;H01L21/768 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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