MODULE ASSEMBLY HAVING INTERFACE MODULE AND INSERTABLE MODULAR JACK
摘要
A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.
申请公布号
EP2179476(A2)
申请公布日期
2010.04.28
申请号
EP20080794853
申请日期
2008.07.30
申请人
TYCO ELECTRONICS CORPORATION
发明人
HERNDON, STEPHEN, SCOTT;BURWELL, ROBERT, JEFFREY;GENIAC, JOSEPH, EDWARD;DOOLEY, CHRISTINE, ANN