发明名称 MODULE ASSEMBLY HAVING INTERFACE MODULE AND INSERTABLE MODULAR JACK
摘要 A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.
申请公布号 EP2179476(A2) 申请公布日期 2010.04.28
申请号 EP20080794853 申请日期 2008.07.30
申请人 TYCO ELECTRONICS CORPORATION 发明人 HERNDON, STEPHEN, SCOTT;BURWELL, ROBERT, JEFFREY;GENIAC, JOSEPH, EDWARD;DOOLEY, CHRISTINE, ANN
分类号 H01R13/518;H01R13/74;H01R24/58;H01R24/64 主分类号 H01R13/518
代理机构 代理人
主权项
地址