发明名称 |
Input/output package architectures, and methods of using same |
摘要 |
A high-speed I/O trace is part of an I/O package architecture for an integrated circuit package substrate. The integrated circuit package substrate includes an integrated heat spreader footprint on a die-side and the I/O trace to couple with an IC device to be disposed inside the IHS footprint. The I/O trace includes a pin-out terminal outside the IHS footprint to couple to an IC device to be disposed outside the IHS footprint. The high-speed I/O trace can sustain a data flow rate from a processor in a range from 5 gigabits per second (Gb/s) to 40 Gb/s.
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申请公布号 |
US7705447(B2) |
申请公布日期 |
2010.04.27 |
申请号 |
US20080286212 |
申请日期 |
2008.09.29 |
申请人 |
INTEL CORPORATION |
发明人 |
GANESAN SANKA;AYGUN KEMAL;RAMASWAMY CHANDRASHEKHAR;PALMER ERIC;BRAUNISCH HENNING |
分类号 |
H01L23/34;H01L23/10;H01L23/28;H01L23/495 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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