ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE

摘要

PURPOSE: An electronic device and a manufacturing method thereof are provided to reduce a crack inside a function unit by reducing the pressure applied in a sealing process due to the contact with a seal metal mold and a light transmitting layer. CONSTITUTION: A resin film made of a first resin is formed on a wafer. A frame unit(102) is formed by patterning the resin film. A frame unit surrounds a function unit and a light transmitting layer(113) on the wafer. A resin layer is formed by injecting a second resin into a cavity of a seal metal mold while contacting with the upper side of the frame unit. Before and after forming the resin layer, the light transmitting layer is formed in a space inside the frame unit.