| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit wiring board which has a fine pitch and high adhesion reliability between circuit wiring and an insulating resin layer while simplifying conventional complicated manufacturing processes. Ž<P>SOLUTION: The method of manufacturing the circuit wiring board includes a step S1 of forming a polyimide precursor resin layer, a step S2 of impregnating the polyimide precursor resin layer with metal ions, a step S3 of preparing a mold having resist ink stuck on a pattern shape surface, a step S4 of forming a resist mask by bringing the pattern shape surface of the mold into contact with a surface of the polyimide precursor resin layer, a step S5 of forming a metal deposition layer by reducing metal ions in the polyimide precursor resin layer, a step S6 of forming circuit wiring on the metal deposition layer, and a step S7 of forming a polyimide resin layer by imidizing the polyimide precursor resin layer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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