ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

摘要

A method of forming an electronic component, comprises mounting an IC (16) on a first side of a substrate (14) which has vias (40) extending partially through the substrate. An encapsulation layer (30) is formed over the IC and a portion of the substrate is then removed a portion of the substrate such that the vias (40) extend through the reduced thickness substrate. A signal redistribution layer (32) is applied and an arrangement of connection elements (26), thereby forming a component for PCB mounting. The signal redistribution layer enables fan out connections to be made. In this way, the size of the substrate is optimized based on the components to be mounted (the IC and passive components). Similarly, the size of the redistribution layer is optimized for the PCB to which the component is to be attached.