| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of cutting a brittle material substrate where, in the case a brittle material substrate is subjected to full cutting using a laser beam having high transmittance with respect to the brittle material substrate, a vertical crack is formed to the terminal end part of a scheduled scribing line on the surface of the brittle material substrate. <P>SOLUTION: The wavelength of a laser beam 41 is controlled to the one at which the laser beam 41 transmits the brittle material substrate 1 by 1 to 90%. Then, after the laser beam 41 is relatively moved to the side edge of the surface of the brittle material substrate 1, further, while relatively moving the laser beam 41 in the thickness direction with respect to the side face of the brittle material substrate 1, the side face of the brittle material substrate 1 is irradiated with the laser beam 41. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
