| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which the time needed to inject a liquid resin used to seal at least a part of the semiconductor device can be shortened, the number of manufacturing steps for the semiconductor device can be reduced, and warpage of the semiconductor device after resin sealing can be reduced, and to provided a semiconductor manufacturing apparatus and the semiconductor device with high reliability. <P>SOLUTION: The liquid resin 9 is injected in a cavity of a metallic mold 300 from a syringe 11 which is installed outside an upper metallic mold 200 and can inject the liquid resin. At this time, the inside of the syringe 11 is pressurized so that the pressure in the syringe 11 is higher than the pressure in the cavity before the liquid resin 9 is injected. The metallic mold 300 is heated after the liquid resin 9 is injected to cure the liquid resin 9. After the liquid resin 9 is cured, the resin-sealed semiconductor device is taken out of the metallic mold 300. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
