ELECTROSTATIC CHUCK AND SUBSTRATE BONDING DEVICE USING THE SAME

摘要

An electrostatic chuck and a substrate bonding device equipped with the electrostatic chuck are disclosed. The electrostatic chuck in accordance with an embodiment of the present invention includes: an elastic holder, in which a center portion of one surface of the elastic holder is formed in a convex shape; an electrode, which is coupled to the elastic holder such that the elastic holder is electrically charged; and a holding unit, which holds the other surface of the elastic holder. The electrostatic chuck in accordance with an embodiment of the present invention can prevent a defect caused by a void formed between substrates while bonding the substrates.