| 摘要 |
<p>Disclosed is a positive-type photosensitive resin composition which can exhibit good edge-rinse properties without the need of containing any surfactant. The positive-type photosensitive resin composition comprises 100 parts by weight of a polyamide resin (A) represented by general formula (1) and 1 to 100 parts by weight of a photosensitive diazoquinone compound (B). When the positive-type photosensitive resin composition is coated on the entire surface of a 6-inch silicon wafer by employing a spin coater to form a coating film on the silicon wafer, the coating film is subjected to the edge-rinsing with OK-73 thinner while rotating the silicon wafer, and subsequently the coating film is dried on a hot plate at 120°C for 4 minutes, the width of an area impregnated with OK-73 thinner in the dried coating film as measured from the edge of the dried coating film is 10 mm or less. (P1 means that the moiety binds to an NH group at this position. In the formula, Y1 and Y2 independently represent an organic group; Z represents an organic group which is different from X; a and b independently represent a molar percentage, wherein the sum total of a and b is 100, a represents a number of 40 to 100 inclusive, and b represents a number of 0 to 60 inclusive; R1's independently represent either a hydroxyl group or O-R4 and may be the same as or different from each other; R4 represents an organic group having 1 to 15 carbon atoms; R2 and R3 independently represent any one group selected from a hydroxyl group, a carboxyl group, O-R5 and COO-R5 and may be the same as or different from each other; R5 represents an organic group having 1 to 15 carbon atoms; and l, m and n independently represent an integer of 0 to 8.)</p> |
