| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing structure for a high-frequency circuit package which is made low-cost and compact and has high reliability. <P>SOLUTION: In the high-frequency circuit package, a high-frequency electronic component mounted on a multilayer ceramic substrate 10 is airtightly sealed with a cover body 30. The airtight sealing structure for the high-frequency electronic component is achieved without using a metal frame (seal ring) by bonding a thick plating portion 35 formed at an outer periphery of a sealing surface of the cover body 30 and a metal pattern portion 15 formed on the multilayer ceramic substrate 10 together by ultrasonic thermocompression. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
