发明名称 SOLUBLE IMIDE-SKELETON RESIN, SOLUBLE IMIDE-SKELETON RESIN SOLUTION COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an imide-skeleton resin which has a low linear expansion coefficient that is about the same as that of a polyimide resin, is excellent in moldability like an epoxy resin, and is useful for a resin composition for an electric laminate. <P>SOLUTION: The imide-skeleton resin is a reaction product of an imide-skeleton-including bisphenol and epichlorohydrin or a product prepared by converting a terminal epoxy group of the reaction product to a terminal hydroxyl group. The imide-skeleton resin includes an imide-skeleton-including linkage represented by general formula (4-1), as a bisphenol residue, in a quantity of at least 5 mol% of the components. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010090360(A) 申请公布日期 2010.04.22
申请号 JP20090182613 申请日期 2009.08.05
申请人 JAPAN EPOXY RESIN KK;MITSUBISHI CHEMICALS CORP 发明人 HIRAI TAKAYOSHI;IMURA TETSURO;TAKAHASHI ATSUSHI
分类号 C08G59/06;C08G59/22;C08G59/62;H05K1/03 主分类号 C08G59/06
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