发明名称 |
SOLUBLE IMIDE-SKELETON RESIN, SOLUBLE IMIDE-SKELETON RESIN SOLUTION COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an imide-skeleton resin which has a low linear expansion coefficient that is about the same as that of a polyimide resin, is excellent in moldability like an epoxy resin, and is useful for a resin composition for an electric laminate. <P>SOLUTION: The imide-skeleton resin is a reaction product of an imide-skeleton-including bisphenol and epichlorohydrin or a product prepared by converting a terminal epoxy group of the reaction product to a terminal hydroxyl group. The imide-skeleton resin includes an imide-skeleton-including linkage represented by general formula (4-1), as a bisphenol residue, in a quantity of at least 5 mol% of the components. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010090360(A) |
申请公布日期 |
2010.04.22 |
申请号 |
JP20090182613 |
申请日期 |
2009.08.05 |
申请人 |
JAPAN EPOXY RESIN KK;MITSUBISHI CHEMICALS CORP |
发明人 |
HIRAI TAKAYOSHI;IMURA TETSURO;TAKAHASHI ATSUSHI |
分类号 |
C08G59/06;C08G59/22;C08G59/62;H05K1/03 |
主分类号 |
C08G59/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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