发明名称 PHENOLIC HYDROXYL GROUP-CONTAINING POLYIMIDE RESIN AND PHOTOSENSITIVE RESIN COMPOSITION USING SAME
摘要 <p>Provided is a resin and a resin composition that are easily synthesized and patterned, and that sufficiently provide characteristics such as flame retardancy, heat resistance, mechanical characteristics, and flexibility. The resin is a phenolic hydroxyl group-containing polyimide resin obtained by condensation polymerization of (a) a tetrabasic acid dianhydride, (b) an aminophenol compound that has at least two amino groups and at least one phenolic hydroxyl group in a molecule, and (c) a diamino compound. In the phenolic hydroxyl group-containing polyimide resin, at least 5 mol% of tetrabasic acid dianhydride (a) is one or more alicyclic tetrabasic acid dianhydrides selected from the group comprising formula (1).</p>
申请公布号 WO2010044381(A1) 申请公布日期 2010.04.22
申请号 WO2009JP67664 申请日期 2009.10.09
申请人 NIPPONKAYAKU KABUSHIKIKAISHA;TANAKA RYUTARO;SEKINE KENJI 发明人 TANAKA RYUTARO;SEKINE KENJI
分类号 C08G73/10;G03F7/004;G03F7/023;H01L21/027 主分类号 C08G73/10
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