| 摘要 |
The inventive power semiconductor module (10) comprises a heat sink (6) and an insulating substrate (2) which is in thermal contact with the heat sink (6). Further, a power semiconductor device (1) is in thermal contact over a first surface with the insulating substrate (2). A cooling member (7) establishes a thermal contact between the insulating substrate (2) and a second side of the power semiconductor device (1). |
