| 摘要 |
Metal-Semiconductor-Metal (“MSM”) photodetectors and methods to fabricate thereof are described. The MSM photodetector includes a thin heavily doped (“delta doped”) layer deposited at an interface between metal contacts and a semiconductor layer to reduce a dark current of the MSM photodetector. In one embodiment, the semiconductor layer is an intrinsic semiconductor layer. In one embodiment, the thickness of the delta doped layer is less than 100 nanometers. In one embodiment, the delta doped layer has a dopant concentration of at least 1×1018 cm−3. A delta doped layer is formed on portions of a semiconductor layer over a substrate. Metal contacts are formed on the delta doped layer. A buffer layer may be formed between the substrate and the semiconductor layer. In one embodiment, the substrate includes silicon, and the semiconductor layer includes germanium.
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