发明名称 Heat-transfer mechanism including a liquid-metal thermal coupling
摘要 Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.
申请公布号 US7701716(B2) 申请公布日期 2010.04.20
申请号 US20080141295 申请日期 2008.06.18
申请人 APPLE INC. 发明人 BLANCO, JR. RICHARD LIDIO;HEIRICH DOUGLAS L.
分类号 H05K7/20;F16D15/00;F16L27/00 主分类号 H05K7/20
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