发明名称 Semiconductor integrated circuit device, method of testing semiconductor integrated circuit device, and probe card used for burn-in stress and D/S tests
摘要 According to one embodiment of the invention, a semiconductor chip includes: a test target circuit to which a given burn-in stress is applied; and a burn-in counter that is configured: to acquire a first parameter indicating a test voltage applied to the test target circuit and a second parameter indicating a temperature of the test target circuit; to estimate the given burn-in stress from the first parameter and the second parameter; and to output burn-in stress information corresponding to the estimated burn-in stress.
申请公布号 US7701237(B2) 申请公布日期 2010.04.20
申请号 US20080199185 申请日期 2008.08.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 OHASHI MASANOBU;KANEKO YOSHIO
分类号 G01R31/02 主分类号 G01R31/02
代理机构 代理人
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