| 发明名称 |
METHOD FOR CUTTING WAFERS FROM A CRYSTAL |
| 摘要 |
A SAWING SUSPENSION WHICH IS COMPOSED OF AN ESSENTIALLY NONAQUEOUS LIQUID IN WHICH HARD-MATERIAL PARTICLES ARE DISPERSED. THE LIQUID IS SELECTED FROM A GROUP OF COMPOUNDS WHICH COMPRISES LOW-MOLECULAR-WEIGHT POLYGLYCOLS AND ANY DESIRED MIXTURES OF SAID COMPOUNDS. THE SAWING SUSPENSION IS USED IN CONJUNCTION WITH A WIRE SAW FOR CUTTING WAFERS FROM A CRYSTAL OF BRITTLE AND HARD MATERIAL.
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| 申请公布号 |
MY141360(A) |
申请公布日期 |
2010.04.16 |
| 申请号 |
MYPI9704847 |
申请日期 |
1997.10.15 |
| 申请人 |
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN MBH |
发明人 |
ALBERT PEMWIESER;MAXIMILIAN KAESER;VERNON KNEPPRATH;WALTER FRANK |
| 分类号 |
B28D1/08;B28D5/04;B28D1/02;C09K3/14;C10M173/02;C10N40/22;C30B33/00;H01L21/304 |
主分类号 |
B28D1/08 |
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