PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A printed circuit board and a semiconductor package using the same are provided to prevent the contamination of a ball land in a filing process by forming a mold flash prevention unit around an aperture of the printed circuit board. CONSTITUTION: A substrate body(104) has an aperture. A connection wiring(112) includes a bond finger unit, a ball land unit, and a connection wiring unit. The bond finger unit is arranged around the aperture of the substrate body. The ball land unit is separated from the bond finger unit. One end of the connection wiring unit is connected to the ball land unit. The other end of the connection wiring is connected to the bond finger unit. A mold flash prevention unit(114) is arranged on the upper side of the connection wiring unit. A solder resist(116) covers the mold flash prevention unit and a connection wiring.