| 摘要 |
PURPOSE: A method for sawing a wafer is provided to prevent the wafer from cracking by pressurizing a scribe region in which a plurality of holes is formed in order to saw semiconductor chips of the wafer. CONSTITUTION: A wafer(106) includes a plurality of semiconductor chips(104) which is divided by a scribe region(102). An adhesive material(108) is attached on the lower side of the wafer. Cutting parts(110) are arranged along the scribe region. The scribe region is pressurized in order to separate the semiconductor chips. The cutting parts are formed using a laser perforating process and a drilling process.
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