| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a removal method using a laser knife and a laser both of which can be more miniaturized than before because there is the problem that both of the laser knife and the laser are generally large in size and made large-sized as the whole of an apparatus because short pulse output is achieved in a short pulse laser beam source by the action of an optical component provided on the outside of a light generator. <P>SOLUTION: Pulse like drive voltage exceeding a voltage value causing relaxation vibration or above is applied to a semiconductor laser to output a laser beam having a pulse-like specific peak from the semiconductor laser. Then, the laser beam having the pulse-like specific peak is condensed to a removal target. <P>COPYRIGHT: (C)2010,JPO&INPIT |
