| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device in which process control is performed considering information on a plurality of masks with different patterns. Ž<P>SOLUTION: The method of manufacturing the semiconductor device includes the steps of: selecting a semiconductor wafer to be processed next, and calculating a first processing condition for processing the semiconductor wafer based upon device information on a processing device and a processing result of a semiconductor wafer of the same kind as the selected semiconductor wafer; calculating a second processing condition by adding a correction value predetermined for a mask with which a pattern is formed on the semiconductor wafer to the first processing condition; processing the semiconductor wafer according to the second processing condition; finding a processing result of the semiconductor wafer and finding a first average value of processing results; finding a mask error indicating a difference between the first average value and a second average value obtained by averaging logs of the first average value; and correcting the correction value based upon the relation between a processing time and a processing result so that an inter-mask variance in mask error becomes small. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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