FLUX, CONDUCTIVE PASTE, BONDED COMPONENT, AND METHOD FOR PRODUCING BONDED COMPONENT

摘要

Disclosed is a flux which is capable of bonding a substrate and an electronic component or the like and does not leave residues after bonding (such as soldering).  Also disclosed are a conductive paste containing the flux, a bonded component formed by bonding constituent members using the conductive paste and having high bonding reliability, and a method for producing the bonded component.  The flux contains an aromatic compound which has two phenolic hydroxy groups in two positions of each aromatic ring, said two positions being next to each other or having one position therebetween.  The aromatic compound has a melting point not less than 23°C at 1 atm.