| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED mounted substrate that can efficiently radiate heat produced by an element, and an LED package and an LED mounting substrate with high versatility constituting the same. <P>SOLUTION: The LED mounted substrate includes the LED package that is mounted to the mounting substrate. The LED package is provided with an electrically natural metal layer covering a region immediately under the LED on its back surface and positive side and negative side metal layers that are connected with the LED element while they pinch the metal layer. The mounting substrate is provided with a front surface that is overlaid on the metal layers and is divided by the metal layer and a rear surface that is lined by the metal layer. A via hole is formed between the metal layer that is overlaid on the electrically natural metal layer of the package among the metal layers on the front surface and the metal layer on the rear surface. An LED package and a mounting substrate constituting the LED mounted substrate are also provided. <P>COPYRIGHT: (C)2010,JPO&INPIT |
